Hot Bar Soldering Design Rules

The connection of the layers are favorably produced with flexible circuit carriers and or foil connectors these connections are prepared mostly by hot b ar reflow soldering.

Hot bar soldering design rules.

The temperature of the stamp transfers the required heat into the joint to be soldered. Hot bar reflow soldering. The parts are then cooled below the solidification temperature to form a permanent electro mechanical bond. Hot bar soldering in this method resistance soldering a heated stamp also cal led bar or thermode is pressing with an adjustable programmable force on the two parts to be joined one lying on top of the other.

Design tips for successful hot bar reflow. Mobile electronics such as telecommunications equipment as well as the electronics in motor vehicles require increasing packing density and thus arrangement of the circuits in multiple layers. Although normal solder will melt at 180 c ideal solder temperature is above 220 c to get a good flowing and wetting behavior but below 280 c to prevent burning of the solder. But some materials ceramic substrates in particular need to be heated in a more controlled fashion to minimize the chance of cracking.

Hot bar reflow soldering systems. Solder must be pre tinned on pcb prior to hot bar process start point for screen printing is a 150 microns thick stencil with a mask opening that results in a 40 pad coverage for small pitch applications it is recommended to pre tin the parts by electro plating as being the most accurate technology. Excessive differences in the heat continue reading pcbs. Most pcb materials like fr2 and fr4 are very resilient to the application of heat during the hot bar reflow soldering or hot bar bonding process.

Hot bar reflow soldering bonding fundamentals technical articles and whitepapers blogs videos training information and more. Hot bar touches the leads 400 c hot bar touches kapton or 500 c ceramics and mc pcb soldering. Flex and pcb designs 1109 08 2010. The hot bar must be set higher due to the thermal transfer losses.

Flex carriers and foil connectors.